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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
INFRARED EMITTING DIODES
LSIR3331/TRS
DATA SHEET
DOC. NO : REV. DATE : :
QW0905- LSIR3331/TRS C 08 - Jun. - 2006
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSIR3331/TRS Page 1/8
Package Dimensions
P2
H
H2 H1 L W0 W1 W3 W2
D
-
+
P1 F P
T
LSIR3331
5.0 5.9
7.6
8.6
1.5MAX
25.0MIN
0.5 TYP
1.0MIN 2.54TYP +Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSIR3331/TRS Page 2/8
Features:
1. High radiant intensity. 2. Suitable for pulsed applications. 3. Low average degradation.
Descriptions:
The LSIR3331/TRS series are super-high efficiency Gallium Aluminum Arsenide infrared emitting diodes encapsulated in Blue Transparent plastic T-1 3/4 package individually.
Device Selection Guide:
PART NO LSIR3331/TRS
MATERIAL AlGaAs/GaAs
LENS COLOR Blue Transparent
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSIR3331/TRS Page 3/8
Absolute Maximum Ratings at Ta=25
Ratings Parameter Symbol SIR Power Dissipation Peak Forward Current (300PPS,10s Pulse) Forward Current Reverse Voltage Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature PD IFP IF Vr ESD Topr Tstg Tsol 100 1 50 5 2000 -40 ~ +85 -40 ~ +85 Max 260 for 5 sec Max (2mm from body) mA A mW V UNIT
V
Electrical Optical Characteristics (Aa=25)
PARAMETER Radiant Intensity Aperture Radiant Incidence Peak Emission Wavelength Spectral Line Half Width Forward Voltage Reverse Current Viewing Angle SYMBOL Min. Le Ee 8.0 1.0 Typ. 12 1.7 880 70 1.4 1.7 100 20 Max. UNIT mW/sr mW/cm nm nm V
2
TEST CONDITION IF=20mA IF=20mA IF=20mA IF=20mA IF=20mA VR=5V
peak
VF IR 21/2
A
deg
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The radiant intensity data did not including 15% testing tolerance.
PART NO. LSIR3331/TRS *Dimensions Symbol Information
Page 4/8
SPECIFICATIONS SYMBOL ITEMS OPTION SYMBOL CODE
-------------------
Minimum mm inch
0.15 0.09
-------
Maximum mm
4.2 3.0 2.0 18.5 22.5 26.5 23.5 20.9 25.0 25.5 20.0 19.4 36 11.0
inch
0.17 0.12 0.08 0.73 0.89 1.04 0.93 0.82 0.98 1.0 0.79 0.76 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75
Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection
D F
H
3.8 2.3
-------
Feed Hole To Bottom Of Component
TRS-1 TRS-2 TRS-3 TRS-5 TRS-6 TRS-7 TRS-8 TRS-9 TRS-10
-------------------------------------------------------------
H1
17.5 21.5 25.5 22.5 19.9 24.0 24.5 19.0 18.0
-------
0.69 0.85 1.0 0.89 0.78 0.94 0.96 0.75 0.72
-------
Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width
H2 L P P1 P2 T W0 W1 W2 W3
W0 12.4 4.4 5.1
-------
0.49 0.17 0.2
-------
13.0 5.8 7.7 1.42 9.75 15.5 4.0 19.0
8.5 14.5 0 17.5
0.33 0.57 0 0.69
REMARK:TRS=Tape And Reel Straight Leads
* Dimensions Symbol Information
Specification Description Symbol minimum mm
Reel Diameter Core Diameter Hub Recess Inside Diameter Arbor Hole Diameter Overall Reel Thickness Iside Reel Flange Thickness
* Package Dimensions
maxmum D3 mm 380 102 88.0 38.1 57.2 inch 14.96 4.02 3.46 1.5 2.25 1.97 T1 T2 D MARKING D2 D1
inch 3.08 1.37 1.13 0.54
D D1 D2 D3 T2 T1
78.2 34.9 28.6 13.8
30.0
1.18 1000PCS
50.0
Quantity/Reel
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSIR3331/TRS Page5/8
Typical Electro-Optical Characteristics Curve
SIR CHIP Fig.1 Forward Current vs. Rorward Voltage
1000
Fig.2 Relative Radiant Intensity vs. Wavelength
1.0
100 10 1 0.1 0.5
Relative Radiant Intensity Normalize @20mA
Forward Current(mA)
0.5
1.0
1.5
2.0
2.5
0.0 750
800
850
900
950
1000
1050
Forward Voltage(V)
Wavelength(nm)
Fig.3 Relative Radiant Power vs. Forward DC Current
10.0
Fig.4 Relative Radiant Power vs. Forward Peak Current
10.0
Relative Radiant Power Normalize @20mA
Relative Radiant Power Normalize @100 mA
10 100
1.0
1.0
0.1 1
0.1 10
100
1000
IFDC(mA)
IFPK(mA)
Fig.5 Forward DC Voltage vs. Temperature Forward DC Voltage @20 mA Normalize @ 25
1.2
Fig.6 Relative Radiant Power vs. Temperature
3.0
Relative Radiant Power Normalize @ 20mA,25
-20 0 20 40 60 80 100
2.5 2.0 1.5 1.0 0.5 0.0 -40
1.1 1.0
0.9 0.8 -40
-20
0
20
40
60
80
100
Ambient Temperature[]
Ambient Temperature[]
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSIR3331/TRS Page 6/8
Storage time:
1.The operation of Temperatures and RH are : 5 ~35,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ~ 35,RH<60%, they should be treated at 605 fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, require some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value.
Circuit model A LED
Circuit model B LED
(A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSIR3331/TRS Page 7/8
Mounting:
1. If the leads are subjected to stress during soldering a printed circuit board, illumination failure may result immediately or later during use. For this reason, make sure that the intervals between the installation holes in the board are equal to the intervals between the leads (after forming if done) so that no stress is applied to the lead.
(O)
(O)
(X)
2. The LED lamps are designed for high-density mounting and have a structure which can alleviate mechanical stress due to clinching . Nevertheless , take care to avoid the occurrence of residual mechanical stress due to clinching .
15
45
Anode side(cathode side on GaAlAs chips)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSIR3331/TRS Page 8/8
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 5 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 5 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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